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Lapmaster CMP machine - List of Manufacturers, Suppliers, Companies and Products

Lapmaster CMP machine Product List

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Wrap Master CMP Machine 'LGP-712'

Wrap Master CMP Machine 'LGP-712'

Compatible with φ8" to φ12" wafers! In-situ pad conditioning is possible during CMP processing.

The LGP-712 is a product that supports the development of high-precision technology for wafers ranging from φ8" to φ12". It is equipped with two polishing heads to accommodate device flattening CMP. It is also suitable as an experimental machine for the research and development of pads and slurries. Our company offers many options to meet customer needs, including support for metal CMP such as Cu-CMP. 【Features】 ■ Capable of ultra-precision polishing ■ Equipped with two polishing heads to accommodate device flattening CMP ■ Supports metal CMP such as Cu-CMP ■ Also suitable as an experimental machine for research and development *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Wrap Master CMP Machine 'LGP-612'

Wrap Master CMP Machine 'LGP-612'

Achieving high-precision grinding! Equipped with multi-stage steps, capable of handling complex grinding recipes.

The LGP-612 is a product that supports the development of high-precision technology equipped with a dual polishing head compatible with wafers ranging from φ4" to φ8". The polishing plate uses ultra-flat alumina ceramics. The polishing head features a mechanism that allows for one-touch replacement, and by employing a low-friction cylinder, it enhances pressure responsiveness. 【Features】 ■ Achieves high-precision polishing with a spindle designed for increased rigidity that can withstand uneven loading ■ The polishing plate uses ultra-flat alumina ceramics ■ Adopts high-precision, high-rigidity LM guides to reduce vibrations, which are uncertain factors during processing ■ Allows for individual input of "pressure" and "rotation speed" for both axes (heads) ■ Supports complex polishing recipes *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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